Форм-фактор

COM Express Type 6

Процессор

11th generation Intel® Core™ i3/i5/i7 / Celeron® processor, up to 4 cores/8 threads:

- Embedded: i7-1185G7E / i5-1145G7E / i3-1115G4E/ Celeron 6305E

- Industrial: i7-1185GRE / i5-1145GRE / i3-1115GRE

Оперативная память

Up to 64GB Dual channel DDR4 Non-ECC 3200 MT/s on 2x SO-DIMM sockets

In-Band ECC support for industrial SKUs

Слоты расширения

1x PCIe Gen3 x4 / 2x PCIe Gen3 x2 / 4x PCIe Gen3 x1 / 1x PCIe Gen3 x2 + 2x PCIe Gen3 x1 (Port 0~3)

1x PCIe Gen3 x1 (Port 4)

1x PCIe Gen3 x2 / 2x PCIe Gen3 x1 (Port 6~7) w/o 2x USB 3.2 Gen 2

Ethernet

1x 2.5GbE via Intel® I225IT

USB

4x USB 3.2 Gen 2 ports (or 2x USB 3.2 Gen 2 and 1x PCIe 3.0 x2/ 2 x1)

8x USB 2.0 ports

Интерфейс дисплея

4 independent displays:

- 2x DDI (HDMI/DP), resolution up to 4K

- 1x LVDS (or eDP), resolution up to 4K

- 1x VGA, resolution up to 2K

Модуль хранения

2x SATA III

Рабочая температура

0~60°C

-40~85°C

Габариты

95 mm x 95 mm

Дополнительные интерфейсы

1x I²C, 1x SMBus, 1x LPC

11th Generation Intel® Core™ processor (Tiger Lake- UP3) based COM Express® Type VI Compact Module with DDR4 up to 64GB, Four Displays, Gigabit Ethernet, PCIe, SATA 3.0, and USB 3.2 Gen 2

PCOM-C60B (ATX Carrier Board)

Cooler

Heat Sink

Heat Spreader

Форм-фактор

COM Express Type 6

Процессор

Intel® Core™ Whiskey Lake U Processor based on Type VI COM Express module with DDR4 SO-DIMM, DDI, eDP, Gigabit Ethernet, SATA 3.0 and USB 3.1

Оперативная память

DDR4-2400MT/s Non-ECC x2 SO-DIMM

Слоты расширения

1x PCIe Gen3 x4

1x PCIe Gen3 x1

1x PCIe Gen3 x1 (Option)

Ethernet

Intel® I219LM

USB

4x USB 3.1 Gen2 (Port 0~3)

8x USB 2.0 (Port 0~7)

Интерфейс дисплея

DDI2

LVDS

DDI1

Модуль хранения

2 x SATA III (Port 0/1)

Рабочая температура

0°C to 60°C

Габариты

95 mm x 95 mm

ОС

Windows 10 Red Hat, Ubuntu, CentOS

PCOM-B653VGL-8665UE

PCOM-B653VGL-8365UE

PCOM-B653VGL-8145UE

PCOM-C605 carrier board

Cooler

Heat spreader

Форм-фактор

COM Express Type 6

Процессор

- PC Client N series (i3-N305)

- Embedded E Series (x7211E, x7213E, x7425E)

- Industrial RE Series (x7211RE, x7213RE, x7433RE, x7835RE)

PCH

SoC

Слоты расширения

Up to 6x Gen 3.0 x1 (2 lanes share with SATA / 2 lanes share with USB)

Ethernet

Intel® I226 series

USB

Up to 4x USB 3.2 Gen2 (2 lanes share with PCIe)

8x USB 2.0

Интерфейс дисплея

 DDI/eDP (LVDS)/VGA

Последовательный ввод-вывод

- GPIO: 8 bit GPIO (default 4 input/4 output)

- I2C: Baud Rate：400KHz

- SMBus: Baud Rate：100KHz

- UART: TX/RX signal only

Модуль хранения

2x SATA III share with PCIe lane

Рабочая температура

0°C to 60°C, -40°C to 85°C

Габариты

95 mm x 95 mm

ОС

Windows 10/11

Ubuntu

Intel Atom® X7000e/x7000RE series SoC based Type VI COM Express Compact module

Cooler (Copper)

Cooler (Aluminum)

Heatsink (Copper)

Heatsink (Aluminum)

Heatspreader (Copper)

Heatspreader (Aluminum)

PCOM-C605R Mini-ITX Carrier

PCOM-C60B ATX Evaluation Carrier

Форм-фактор

COM Express Type 6

Процессор

Intel Atom® x6425RE/x6413E/x6414RE or Intel® Pentium® J6426

Чипсет

SoC integrated

Слоты расширения

5 x PCIe x1

6 x PCIe x1 (optional, by removing 2.5GbE)

Ethernet

1 x 10/100/1000/2500 Mbps Ethernet (Intel® I226)

USB

2 x USB 3.2 Gen1

8 x USB 2.0

Интерфейс дисплея

 1 x LVDS; 18/24-bit single/dual-channel (optional eDP 1.4b HBR3: 5120 x 3200 @ 60Hz)

2 x DDI

Последовательный ввод-вывод

1 x LPC

1 x SPI

2 x TX/RX

Модуль хранения

2 x SATA 3.0

eMMC5.1, up to 64GB

Рабочая температура

0°C to +60°C

-40°C to +85°C

Габариты

95 mm x 95 mm

CEM322-x6413E (P/N-E38D322100)

COM Express Type 6 Compact module with Intel Atom® x6413E, DDI, LVDS, 3.2 Gen 1, and GbE LAN

CEM322-x6414RE (P/N-E38D322102)

COM Express Type 6 Compact module with Intel Atom® x6414RE, DDI, LVDS, 3.2 Gen 1, GbE LAN, and wide temperature support

CEB94011 (P/N-E394011101)

COM Express Type 6 evaluation board

712000008700

CEM322 heat sink w/o fan

712000009000

CEM322 heat spreader

Форм-фактор

COM Express Type 6

Процессор

13th/12th Gen Intel® Core™ processor (U series)

Чипсет

SoC integrated

Оперативная память

2 x Dual-channel DDR4-3200 SO-DIMM slot, up to 64GB

Последовательный интерфейс

1 x LPC

1 x SPI

2 x TX/RX

Слоты расширения

1 x PCIe x4 Gen4 (PEG) + 5 x PCIe Gen3 (Default)

1 x PCIe x4 Gen4 (PEG) + 8 x PCIe Gen3 (by request)

Ethernet

1 x 10/100/1000/2500 Mbps Ethernet (Intel® I226)

USB

4 x USB 3.2

8 x USB 2.0

Интерфейс дисплея

1 x LVDS; 18/24-bit single/dual channel (optional eDP 1.4b HBR3: 5120 x 3200 @ 60Hz)

1 x VGA; 1920 x 1200 @ 60Hz (default)

2 x Display type (with up to 4K supported)

Модуль хранения

2 x SATA 3.0

NVMe for up to 512GB (optional)

Рабочая температура

0~60°C

-40~85°C

Габариты

95 mm x 95 mm

COM Express Type 6 Compact module with Intel® Core™ i7-1365URE, DDI, VGA, LVDS, 2.5GbE LAN, 64GB NVMe, TPM, and extended temperature

COM Express Type 6 Compact module with Intel® Core™ i5-1345URE, DDI, VGA, LVDS, 2.5GbE LAN, 64GB NVMe, TPM, and extended temperature

COM Express Type 6 Compact module with Intel® Core™ i3-1315URE, DDI, VGA, LVDS, 2.5GbE LAN, 64GB NVMe, TPM, and extended temperature

COM Express Type 6 Compact module with Intel® Celeron® U300E, DDI, VGA, LVDS, 2.5GbE LAN, and TPM

COM Express Type 6 evaluation board

CEM561 STD thermal cooler

CEM561 turbo thermal cooler

CEM561 heat spreader

Форм-фактор

COM Express Type 6

Процессор

AMD Ryzen™ Embedded V1000 series

V1202B / 2.3 GHz (12-25W)

V1605B / 2.0 GHz (12-25W)

V1756B / 3.25 GHz (35-54W)

V1807B / 3.35 GHz (35-54W)

Чипсет

SoC integrated

Оперативная память

2 x Dual-channel DDR4-2400/3200 non-ECC/ECC SO-DIMM, up to 64GB

Последовательный интерфейс

1 x LPC

1 x SPI

2 x TX/RX

Слоты расширения

7 x PCIe x1 via PCIe bridge

Ethernet

1 x 10/100/1000 Mbps Ethernet (Intel® i210)

USB

3 x USB 3.0

8 x USB 2.0

Интерфейс дисплея

1 x VGA; 1920 x 1200 @60Hz

1 x LVDS dual-channel 18/24-bit or eDP 1.3 (optional)

2 x DDI (HDMI 1.4, DVI, DisplayPort 1.2)

Модуль хранения

2 x SATA-600

Рабочая температура

-20°C to +60°C

Габариты

95 mm x 95 mm

CEM130-V1202B (P/N-E38D130103)

COM Express Type 6 Compact module with AMD Ryzen™ Embedded V1202B, DDI, LVDS, GbE LAN, USB 3.0 and TPM

CEM130-V1605B (P/N-E38D130102)

COM Express Type 6 Compact module with AMD Ryzen™ Embedded V1605B, DDI, LVDS, GbE LAN, USB 3.0 and TPM

CEM130-V1756B (P/N-E38D130101)

COM Express Type 6 Compact module with AMD Ryzen™ Embedded V1756B, DDI, LVDS, GbE LAN, USB 3.0 and TPM

CEM130-V1807B (P/N-E38D130100)

COM Express Type 6 Compact module with AMD Ryzen™ Embedded V1807B, DDI, LVDS, GbE LAN, USB 3.0 and TPM

CEB94011 (P/N-E394011100)

COM Express Type 6 application board

E39J014100

CEM130 heat sink with fan

7128D130000E

CEM130 heat spreader

Форм-фактор

COM Express Type 6

Процессор

Intel® Core™ i7-8665UE/i5-8365UE/i3-8145UE processor (Whiskey Lake-U) & Intel® Celeron® processor 4305UE

Чипсет

SoC integrated

Оперативная память

2 x Dual-channel DDR4-2400 SO-DIMM slot, up to 64GB

Последовательный интерфейс

1 x LPC

1 x SPI

2 x TX/RX

Слоты расширения

8 x PCI Express Gen3 (max. 5 PCIe devices without LAN)

Ethernet

1 x 10/100/1000 Mbps Ethernet (Intel® i219-LM)

USB

4 x USB 3.0

8 x USB 2.0

Интерфейс дисплея

1 x LVDS (optional eDP 1.4: 4096 x 2304@60Hz)

1 x VGA 1920 x 1200 @60Hz (default)

1 x DDI (DisplayPort 1.2: 4096 x 2304@60Hz/HDMI 1.4: 4096 x 2160@30/24Hz)

Модуль хранения

3 x SATA Gen3

Рабочая температура

-40°C to +85°C

Габариты

95 mm x 95 mm

CEM521-i7-8665UE (P/N-E38D521100)

COM Express Type 6 Compact module with Intel® Core™ i7-8665UE, DDI, VGA, LVDS, GbE LAN, USB 3.0 and TPM

CEM521-i5-8365UE (P/N-E38D521102)

COM Express Type 6 Compact module with Intel® Core™ i5-8365UE, DDI, VGA, LVDS, GbE LAN, USB 3.0 and TPM

CEM521-i3-8145UE (P/N-E38D521104)

COM Express Type 6 Compact module with Intel® Core™ i3-8145UE, DDI, VGA, LVDS, GbE LAN, USB 3.0 and TPM

CEM521-Cel-4305UE (P/N-E38D521105)

COM Express Type 6 Compact module with Intel® Celeron® 4305UE, DDI, VGA, LVDS, GbE LAN, USB 3.0 and TPM

CEM521-i7-8665UE (Ind.) (P/N-E38D521110)

COM Express Type 6 compact module with Intel® Core™ i7-8665UE DDI VGA LVDS GbE LAN USB 3.0 and TPM (wide temperature)

CEM521-i5-8365UE (Ind.) (P/N-E38D521111)

COM Express Type 6 compact module with Intel® Core™ i5-8365UE DDI VGA LVDS GbE LAN USB 3.0 and TPM (wide temperature)

CEM521-i3-8145UE (Ind.) (P/N-E38D521112)

COM Express Type 6 compact module with Intel® Core™ i3-8145UE DDI VGA LVDS GbE LAN USB 3.0 and TPM (wide temperature)

CEB94011 (P/N-E394011100)

COM Express Type 6 evaluation board

E39J016100

CEM521 heat sink with fan

7128D521000E

CEM521 heat spreader

Форм-фактор

COM Express Type 6

Процессор

Soldered onboard Intel^® Core™ Ultra Processor

- Core Ultra 7 165U 1.7GHz / 4.9GHz (Turbo)

- Core Ultra 7 155U 1.7GHz / 4.8GHz (Turbo)

- Core Ultra 5 135U 1.6GHz / 4.4GHz (Turbo)

- Core Ultra 5 125U 1.3GHz / 4.3GHz (Turbo)

Оперативная память

2 x DDR5 SO-DIMM sockets

Последовательный интерфейс

2 x UART ports (RX/TX only)

Слоты расширения

2 x PCIex4 lanes

8 x PCIex1 lanes (or 1 x PCIex4 + 4 x PCIex1)

I²C, GPIO, SMBUS, LPC Interface

Ethernet

1 x Intel^® i226 Series PCIe 2.5 GbE Ethernet controller

USB

12 x USB ports:

- 8 x USB 2.0 ports

- 4 x USB 3.0 ports

Интерфейс дисплея

1 x Dual Channel 24-bit LVDS (default) or eDP

1 x Analog RGB port

3 x DDI ports

Модуль хранения

2 x SATA ports with 600MB/s HDD transfer rate,

1 x NVMe SSD (Optional)(Share With PEG 1 x PCIex4 lanes)

Рабочая температура

-40 ~ 85°C

Габариты

95 mm x 95 mm

EmCOMe-i95U0-WT-165U

Intel^® Core™ Ultra 7 165U COMe Compact Type 6 CPU module, -40 ~ 85°C

EmCOMe-i95U0-WT-155U

Intel^® Core™ Ultra 7 155U COMe Compact Type 6 CPU module, -40 ~ 85°C

EmCOMe-i95U0-WT-135U

Intel^® Core™ Ultra 5 135U COMe Compact Type 6 CPU module, -40 ~ 85°C

EmCOMe-i95U0-WT-125U

Intel^® Core™ Ultra 5 125U COMe Compact Type 6 CPU module, -40 ~ 85°C

HS-95U0-C1

Heat sink with Fan (95x95x37.6mm)

HS-95U0-F1-NT

Heat spreader, non-threaded standoffs (bore hole) (95x95x11mm)

HS-95U0-F1-T

Heat spreader, threaded standoffs (bore hole) (95x95x11mm)

PBE-1705

COM Express^® Type 6 carrier board (ATX form factor)

CBK-03-1705-00

Cable kit

1 x SATA cable

2 x COM Flat cables

Форм-фактор

COM Express Type 6

Процессор

Intel® Core Ultra X9 Series

Intel® Core Ultra X7 Series

Intel® Core Ultra 5 Series

Intel® Core Ultra 7 Series

Оперативная память

2x SO-DIMM DDR5 up to 128GB 7200 MT/s

Интерфейс дисплея

eDP / LVDS eDP up to HBR3 3840 x 2160@120Hz

eDP / LVDS LVDS (24bit, dual channel) 1920 x 1200@60Hz

DDI 1/2/3 DP up to HBR3 3840 x 2160@120Hz

DDI 1/2/3 HDMI® 2.1

DDI 1/2/3 USB4 40Gb

Слоты расширения

USB4, USB 3.2, USB 2.0, SATA, 2.5GbE

Ethernet

1x 2.5 Gbe LAN (Shared w/ PCIe)

USB

4x USB 3.2 Gen1 x2

8x USB 2.0

Модуль хранения

PCIe (NVMe) up to 256GB

2x SATA III (Shared w/ PCIe)

Рабочая температура

-40 ~ 85 °C

Габариты

95 mm x 95 mm

ОС

Linux, Windows 11

PCOM-B65B

Intel® Core Ultra X9 388H

Intel® Core Ultra X7 368H

Intel® Core Ultra X7 358H

Intel® Core Ultra 5 338H

Intel® Core Ultra 7 365RE

Intel® Core Ultra 7 365

Intel® Core Ultra 7 355

Intel® Core Ultra 5 325

Форм-фактор

COM Express Type VI Compact Size Module

Процессор

13th Gen Intel® Core™ i7/i5/i3 processors, up to 14 cores/16 threads

P series Industrial: i7-1370PRE / i5-1350PRE / i3-1320PRE

P series Embedded: i7-1370PE / i5-1350PE / i5-1340PE / i3-1320PE

U series Industrial: i7-1365URE / i5-1345URE / i3-1315URE

U series Embedded: i7-1365UE / i5-1345UE / i5-1335UE / i3-1315UE / U300E

Оперативная память

DDR5 SO-DIMM up to 96GB 5200MT/s

Serial I/O

GPIO: 8 bit GPIO (default 4 input/4 output)

I2C: Baud Rate: 400KHz

SMBus: Baud Rate: 100KHz

UART: TX/RX signal only

Ethernet

Intel® I226 series (Support TSN/TCC on industrial SKU)

USB

2x USB4 (option; default interface DDI)

4x USB 3.2 Gen2

8x USB 2.0

PCI Express Gen4

2x Gen4 x4

PCI Express Gen3

8x Gen 3.0 x1 (2 lanes share with SATA, 1 lane share with LAN)

Модуль хранения

2x SATA III share with PCIe lane

Рабочая температура

-40°C to 85°C

Габариты

95 mm x 95 mm

ОС

Windows 10/11

Ubuntu

PCOM-B659

COM Express Type VI Compact Size Module. 13th Gen Intel® Core™ Processors. DDR5 SO-DIMM, DDI, PCIe Gen 4, USB4, USB 3.2 Gen 2, 2.5 GbE TSN Ethernet, discrete TPM 2.0, eDP, SATAIII

AB1-3P78

PCOM-C605R Mini-ITX Carrier

AB1-3G22

PCOM-C60B ATX Evaluation Carrier

Cooler (Heatpipe)

Heatsink (Heatpipe)

Heatspreader (Heatpipe)